SCOPE
The scope of the conference covers all topics related to engineering, technology, and applications. Some of the topics are listed but not limited to:
TOPIC 1: MECHANICAL
MATERIALS SCIENCE & ENGINEERING
Composite, Polymeric materials, Biomaterial, Nanomaterials, Surface science, Ceramics, Metals, Metallurgy, Fracture Mechanics, Fatigue Crack Initiation & Propagation, Structural Durability & Reliability, Finite Element Analysis, Failure Analysis, Damage Mechanics & Assessment, Computational Mechanics
MECHANICAL DESIGN & MANUFACTURING
Machine Design, Computer Aided Engineering Design, Additive Manufacturing, Machining, Metal Forming, Joining, Welding, Tribology, Design Optimization, Computational Biomechanics, Sport Biomechanics
TOPIC 2: ELECTRICAL & ELECTRONIC
ROBOTIC, AUTOMATION & CONTROL SYSTEMS
I Robotic drones I Artificial intelligence I Sensors and actuators I Automation technology I Automation manufacturing I Process control I Computer-automated design I Mechatronics I
INSTRUMENTATION
Sensors, Biomedical Metrology, Microelectronics, Health Monitoring Devices, Embedded Signal Processing, Electrical Bio-Impedance, Electromagnetism, mechatronics, Biochips, Implantable Electronics, Biotelemetry, Biomaterials, MEMS, Nanotechnologies, Computer-aided Detection and Diagnosis, Brain-Computer Interfaces, Electromagnetic Fields innovatios.
SIGNAL & IMAGE PROCESSING
Signal/Image Acquisition, Analysis and Processing, Wearable Sensors and Systems, Biometrics, Acoustic Signal Processing, Time and Frequency Analysis, Bio-signal Modelling, Non-linear Dynamics, Monitoring and Telemetry, Medical Imaging
ARTIFICIAL INTELLIGENCE
Machine Learning, Neural Network, Natural Language Processing (NLP), Speech Recognition, Expert System, Planning, Scheduling and Optimization, Robotics, Vision (Image Recognition & Machine Vision), Big Data.